ANSYS Q3D Extractor efficiently performs the 3D and 2D quasi-static electromagnetic field simulations required for the extraction of RLCG parameters from an interconnect structure. It then automatically generates an equivalent SPICE subcircuit model. These highly accurate models can be used to perform signal integrity analysis to study electromagnetic phenomena, such as crosstalk, ground bounce, interconnect delays and ringing, to understand the performance of interconnects, IC packages, connectors, PCB’s, bus bars and cables.
Q3D Extractor provides partial inductance and resistance extractions that help design DC-DC power converters, along with unit cell capacitance extractions for touchscreen devices. To accelerate model creation, it can also import files from well-known MCAD and ECAD providers such as Altium, Autodesk, Cadence, Dassault, Mentor Graphics, PTC and Zuken. This greatly improves the efficiency of analyzing modern electronic packages and PCBs to ensure proper performance of integrated circuits. Q3D Extractor seamlessly transfers data to different ANSYS physics solvers, such as ANSYS Icepak for thermal design and ANSYS Mechanical for structural analysis, to deliver industry-leading multiphysics analysis.